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Process Equipment

Besi offers a wide range of advanced packaging equipment based on leading-edge technology. The complete offering includes; multi-chip bonders for advanced packaging, epoxy and soft solder bonders, high precision flip chip bonders, stacked die bonders, trim & form,  package mold, singulation and plating systems.

IPG Photonics - Leading developer and manufacturer of high-performance fiber lasers & automated fiber laser systems. IPG Photonics' diverse lines of low, medium and high-power lasers and amplifiers are used in materials processing, communications, entertainment, medical, biotechnology, scientific and advanced applications


MicroAssembly Technologies (MAT) - Specializes in manufacturing Die Attach machines and providing turn-key solutions for most advanced die attach applications.


Table Top Die Attach System


Nordson March - Providing a long tradition of innovation that has made Nordson the leading manufacturer of Gas Plasma Equipment for advanced packaging applications. Improve all of your assembly processes including wire bonding, die bonding, & encapsulation.


Plasma Treatment Systems

AP Series


SST International - Flux-free, void-free, Fiber-Optic & Microelectronic Vacuum Sealing and Solder Reflow Furnaces. Applications include: die & substrate attach, low moisture package lid sealing, glass-to-metal sealing, wafer to glass bonding, solder ball attach, brazing, and many others.


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Multi-Axis Welding - Micro

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