Process Equipment

Besi offers a wide range of advanced packaging equipment based on leading-edge technology. The complete offering includes; multi-chip bonders for advanced packaging, epoxy and soft solder bonders, high precision flip chip bonders, stacked die bonders, trim & form,  package mold, singulation and plating systems.

Datacon 2200 evo Advanced
Datacon 2200 evo Advanced

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Datacon 2200Evo
Datacon 2200Evo

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Fico AMS-W
Fico AMS-W

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Datacon 2200 evo Advanced
Datacon 2200 evo Advanced

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F&S Bondtec Austria serves the desktop equipment segment and supplies the most complete program worldwide for bonding and testing equipment. Only F&S Bondtec Austria can offer you a secure investment into the future: our Desktop-Micro-Factory which provides all wire bond processes and, in addition, all test methods in a single desktop machine base.

Fully Automatic and Manual

Wire Bonders

Gold Ball Bonding, Thin and Thick

Wire and Heavy Ribbon Bonding

Series 53
Series 53

Table Top Manual Wire Bonder

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Series 56
Series 56

Semi-Automatic Wire Bonder

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Series 58
Series 58

Automatic Wire Bonder

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Series 53
Series 53

Table Top Manual Wire Bonder

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IPG Photonics - Leading developer and manufacturer of high-performance fiber lasers & automated fiber laser systems. IPG Photonics' diverse lines of low, medium and high-power lasers and amplifiers are used in materials processing, communications, entertainment, medical, biotechnology, scientific and advanced applications

ILT Versa
ILT Versa

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ILT 1500
ILT 1500

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Multi-Axis Welding - Micro
Multi-Axis Welding - Micro

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ILT Versa
ILT Versa

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MicroAssembly Technologies (MAT) - Specializes in manufacturing Die Attach machines and providing turn-key solutions for most advanced die attach applications.


 

Table Top Die Attach System

 
6410
6410

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6400
6400

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6410
6410

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Nordson March - Providing a long tradition of innovation that has made Nordson the leading manufacturer of Gas Plasma Equipment for advanced packaging applications. Improve all of your assembly processes including wire bonding, die bonding, & encapsulation.


 

Plasma Treatment Systems

AP Series

 

AP-300 Plasma System
AP-300 Plasma System

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AP Batch Series Plasma
AP Batch Series Plasma

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TRAK Automated Series
TRAK Automated Series

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AP-300 Plasma System
AP-300 Plasma System

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SST International - Flux-free, void-free, Fiber-Optic & Microelectronic Vacuum Sealing and Solder Reflow Furnaces. Applications include: die & substrate attach, low moisture package lid sealing, glass-to-metal sealing, wafer to glass bonding, solder ball attach, brazing, and many others.

 

3150 High Vacuum Furnace
3150 High Vacuum Furnace

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SST 8300 Series Automated Vacuum Pressur
SST 8300 Series Automated Vacuum Pressur

NEW

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SST 1200 Table Top Furnace
SST 1200 Table Top Furnace

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3150 High Vacuum Furnace
3150 High Vacuum Furnace

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