Chalman Technologies
Over 35 years' experience selling semiconductor, fiber-optic, and microelectronic materials & equipment
Process Equipment
Advanced Dicing Technologies (ADT) specializes in the development and manufacturing of systems, blades and processes used in the dicing of silicon-based ICs, Package Singulation and hard material Microelectronic Components (MEC). ADT offers dicing equipment with a variety of capabilities, configurations and levels of automation, as well as peripheral instrumentation and accessories, to suit an ever-growing range of customer requirements.
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7100 Series
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8030
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Laser Mapping System
Besi offers a wide range of advanced packaging equipment based on leading-edge technology. The complete offering includes; multi-chip bonders for advanced packaging, epoxy and soft solder bonders, high precision flip chip bonders, stacked die bonders, trim & form, package mold, singulation and plating systems.
F&S Bondtec Austria serves the desktop equipment segment and supplies the most complete program worldwide for bonding and testing equipment. Only F&S Bondtec Austria can offer you a secure investment into the future: our Desktop-Micro-Factory which provides all wire bond processes and, in addition, all test methods in a single desktop machine base.
Gold Ball Bonding, Thin and Thick
Wire and Heavy Ribbon Bonding
Table Top Manual Wire Bonder
Semi-Automatic Wire Bonder
Automatic Wire Bonder
Table Top Manual Wire Bonder
IPG Photonics - Leading developer and manufacturer of high-performance fiber lasers & automated fiber laser systems. IPG Photonics' diverse lines of low, medium and high-power lasers and amplifiers are used in materials processing, communications, entertainment, medical, biotechnology, scientific and advanced applications
MicroAssembly Technologies (MAT) - Specializes in manufacturing Die Attach machines and providing turn-key solutions for most advanced die attach applications.
Nordson March - Providing a long tradition of innovation that has made Nordson the leading manufacturer of Gas Plasma Equipment for advanced packaging applications. Improve all of your assembly processes including wire bonding, die bonding, & encapsulation.
Plasma Treatment Systems
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FlexTRAK Plasma System
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FlexTRAK-S Plasma System
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FlexTRAK-SHS Plasma System
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FlexTRAK-2MB Plasma System
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FlexTRAK-CD Plasma System
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FlexTRAK-CDS Plasma System
Millice- Workpiece temporary adhesive materials - conductive and high temperature. WaferGrip™ and TrueGrip™ are advanced composite film adhesives engineered to bond wafers, thin film heads, optics, and other substrates during dicing, grinding, lapping, and polishing. StripAid™ X Solvent is a biodegradable hydrocarbon plasticizer used for debonding WaferGrip™ temporary adhesive, leaving no debris or residue behind.
Vacunite 24/12/6
Vacunite 24/12/6