Process Equipment
ADT Dicing Logo cropped.jpg

Advanced Dicing Technologies (ADT) specializes in the development and manufacturing of systems, blades and processes used in the dicing of silicon-based ICs, Package Singulation and hard material Microelectronic Components (MEC).  ADT offers dicing equipment with a variety of capabilities, configurations and levels of automation, as well as peripheral instrumentation and accessories, to suit an ever-growing range of customer requirements. 

8020 Fully Automatic Twin Dicing System
8020 Fully Automatic Twin Dicing System

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Dicing Blades
Dicing Blades

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ADT 7220 series
ADT 7220 series

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8020 Fully Automatic Twin Dicing System
8020 Fully Automatic Twin Dicing System

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Besi offers a wide range of advanced packaging equipment based on leading-edge technology. The complete offering includes; multi-chip bonders for advanced packaging, epoxy and soft solder bonders, high precision flip chip bonders, stacked die bonders, trim & form,  package mold, singulation and plating systems.

Datacon 2200 evo Advanced
Datacon 2200 evo Advanced

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Datacon 2200Evo
Datacon 2200Evo

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Fico AMS-W
Fico AMS-W

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Datacon 2200 evo Advanced
Datacon 2200 evo Advanced

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F&S.JPG

F&S Bondtec Austria serves the desktop equipment segment and supplies the most complete program worldwide for bonding and testing equipment. Only F&S Bondtec Austria can offer you a secure investment into the future: our Desktop-Micro-Factory which provides all wire bond processes and, in addition, all test methods in a single desktop machine base.

Fully Automatic and Manual

Wire Bonders

Gold Ball Bonding, Thin and Thick

Wire and Heavy Ribbon Bonding

Series 53
Series 53

Table Top Manual Wire Bonder

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Series 56
Series 56

Semi-Automatic Wire Bonder

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Series 58
Series 58

Automatic Wire Bonder

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Series 53
Series 53

Table Top Manual Wire Bonder

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IPG Photonics - Leading developer and manufacturer of high-performance fiber lasers & automated fiber laser systems. IPG Photonics' diverse lines of low, medium and high-power lasers and amplifiers are used in materials processing, communications, entertainment, medical, biotechnology, scientific and advanced applications

ILT 1500
ILT 1500

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IPG SYS750
IPG SYS750

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ILT Glovebox
ILT Glovebox

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ILT 1500
ILT 1500

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MicroAssembly Technologies (MAT) - Specializes in manufacturing Die Attach machines and providing turn-key solutions for most advanced die attach applications.


 

Table Top Die Attach System

 
6410
6410

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MAT 6200 - Crossover
MAT 6200 - Crossover

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6400
6400

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6410
6410

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Nordson March - Providing a long tradition of innovation that has made Nordson the leading manufacturer of Gas Plasma Equipment for advanced packaging applications. Improve all of your assembly processes including wire bonding, die bonding, & encapsulation.


 

Plasma Treatment Systems

AP Batch Series

TRAK Automated Series

  • FlexTRAK Plasma System

  • FlexTRAK-S Plasma System

  • FlexTRAK-SHS Plasma System

  • FlexTRAK-2MB Plasma System

  • FlexTRAK-CD Plasma System

  • FlexTRAK-CDS Plasma System

SPHERE Wafer Series

  • MesoSPHERE Plasma System

  • StratoSPHERE Plasma System

AP-300 Plasma System
AP-300 Plasma System

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AP-1000 Batch Series Plasma
AP-1000 Batch Series Plasma

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FlexTRAK-SHS
FlexTRAK-SHS

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AP-300 Plasma System
AP-300 Plasma System

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Centrotherm- World Leading Supplier for vacuum and pressure furnaces for vacuum soldering, brazing and sealing for microelectronics packages and components. The VLO system platform covers a wide range of applications fromm R&D processing to high-volume production.

Vacuum Sealing & Solder Reflow Systems

 
Vacunite Single Plate
Vacunite Single Plate

Vacunite 24/12/6

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Vacunite Single Plate
Vacunite Single Plate

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0f8eacad-1546-43cf-b318-ff216e69e539_Heizplatte_c.VACUNITE-300
0f8eacad-1546-43cf-b318-ff216e69e539_Heizplatte_c.VACUNITE-300

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Vacunite Single Plate
Vacunite Single Plate

Vacunite 24/12/6

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