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                          Process Equipment

 

Advanced Dicing Technologies (ADT) 

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Specializes in the development and manufacturing of systems, blades and processes used in the dicing of silicon-based ICs, Package Singulation and hard material Microelectronic Components (MEC). 

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Besi offers a wide range of advanced packaging equipment based on leading-edge technology. The complete offering includes; multi-chip bonders for advanced packaging, epoxy and soft solder bonders, high precision flip chip bonders, stacked die bonders, trim & form,  package mold, singulation and plating systems.

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The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications.  This versatile unit can also be used for many other automation processes.

 

The Esec 2100 series die bonders are the most flexible high speed platforms on the market.  Designed to handle high volume lead frames, strips and boats.

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Fico - Designs, develops and manufactures molding, trim & form and singulation systems. The reliable systems can process a wide variety of packages. Automatic as well as manual systems use the same molds or tools.

 

IPG Photonics - Leading developer and manufacturer of high-performance fiber lasers & automated fiber laser systems. IPG Photonics' diverse lines of low, medium and high-power lasers and amplifiers are used in materials processing, communications, entertainment, medical, biotechnology, scientific and advanced applications.

 

March Instruments - Providing a long tradition of innovation that has made Nordson the leading manufacturer of Gas Plasma Equipment for advanced packaging applications. Improve all of your assembly processes including wire bonding, die bonding, & encapsulation.

 

Centrotherm - Centrotherm is a world Leading Supplier for vacuum and pressure furnaces for vacuum soldering, brazing and sealing for microelectronics packages and components. The VLO system platform covers a wide range of applications fromm R&D processing to high-volume production.

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Rework, Metrology & Test Equipment

 

        Cyber Technologies - Leading supplier of high-resolution, non-contact 3D Measurement Systems for industrial & electronics applications. The heart of the system is a high resolution optical sensor either laser-based or with a white light source.

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Dage - Benchmark for Bond Strength Testers. The new Dage model 4000 leads the industry in accuracy for 1) wire pull, 2) die shear, 3) ball / bump shear, 4) cold bump pull, & 5) tweezer pull. Dage is now expanding into X-ray Inspection Equipment & Scanning Acoustic Microscopes.

 

 

Midas Technology, Inc. - The leader in Fiber Optic/Hybrid/MCM Rework Equipment. Machine models include the DL-4 de-lidder for lid removal, as well as the HGRS-V Hot Gas Rework System for the removal of die and substrates attached by any methods.

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NorCom Systems, Inc. - The NEW industry standard for leak testing utilizing the revolutionary NorCom 2020 Series Optical Leak Tester. Test for both gross and fine leaks simultaneously in a 2-4 minute cycle without the need for helium bombing.

 

 

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