Process Equipment

Besi offers a wide range of advanced packaging equipment based on leading-edge technology. The complete offering includes; multi-chip bonders for advanced packaging, epoxy and soft solder bonders, high precision flip chip bonders, stacked die bonders, trim & form,  package mold, singulation and plating systems.

Datacon 2200 evo Advanced
Datacon 2200 evo Advanced

Datacon 2200Evo
Datacon 2200Evo

Fico AMS-W
Fico AMS-W

Datacon 2200 evo Advanced
Datacon 2200 evo Advanced

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F&S.JPG

F&S Bondtec Austria serves the desktop equipment segment and supplies the most complete program worldwide for bonding and testing equipment. Only F&S Bondtec Austria can offer you a secure investment into the future: our Desktop-Micro-Factory which provides all wire bond processes and, in addition, all test methods in a single desktop machine base.

Fully Automatic and Manual

Wire Bonders

Gold Ball Bonding, Thin and Thick

Wire and Heavy Ribbon Bonding

Series 53
Series 53

Table Top Manual Wire Bonder

Series 56
Series 56

Semi-Automatic Wire Bonder

Series 58
Series 58

Automatic Wire Bonder

Series 53
Series 53

Table Top Manual Wire Bonder

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IPG Photonics - Leading developer and manufacturer of high-performance fiber lasers & automated fiber laser systems. IPG Photonics' diverse lines of low, medium and high-power lasers and amplifiers are used in materials processing, communications, entertainment, medical, biotechnology, scientific and advanced applications

ILT Versa
ILT Versa

ILT 1500
ILT 1500

Multi-Axis Welding - Micro
Multi-Axis Welding - Micro

ILT Versa
ILT Versa

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MicroAssembly Technologies (MAT) - Specializes in manufacturing Die Attach machines and providing turn-key solutions for most advanced die attach applications.


 

Table Top Die Attach System

 
6410
6410

6400
6400

6410
6410

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Nordson March - Providing a long tradition of innovation that has made Nordson the leading manufacturer of Gas Plasma Equipment for advanced packaging applications. Improve all of your assembly processes including wire bonding, die bonding, & encapsulation.


 

Plasma Treatment Systems

AP Series

 

AP-300 Plasma System
AP-300 Plasma System

AP Batch Series Plasma
AP Batch Series Plasma

TRAK Automated Series
TRAK Automated Series

AP-300 Plasma System
AP-300 Plasma System

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SST International - Flux-free, void-free, Fiber-Optic & Microelectronic Vacuum Sealing and Solder Reflow Furnaces. Applications include: die & substrate attach, low moisture package lid sealing, glass-to-metal sealing, wafer to glass bonding, solder ball attach, brazing, and many others.

 

3150 High Vacuum Furnace
3150 High Vacuum Furnace

SST 8300 Series Automated Vacuum Pressur
SST 8300 Series Automated Vacuum Pressur

NEW

SST 1200 Table Top Furnace
SST 1200 Table Top Furnace

3150 High Vacuum Furnace
3150 High Vacuum Furnace

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