© 2023 by Coach.Corp. Proudly created with Wix.com

Process Equipment

Besi offers a wide range of advanced packaging equipment based on leading-edge technology. The complete offering includes; multi-chip bonders for advanced packaging, epoxy and soft solder bonders, high precision flip chip bonders, stacked die bonders, trim & form,  package mold, singulation and plating systems.

IPG Photonics - Leading developer and manufacturer of high-performance fiber lasers & automated fiber laser systems. IPG Photonics' diverse lines of low, medium and high-power lasers and amplifiers are used in materials processing, communications, entertainment, medical, biotechnology, scientific and advanced applications

 

MicroAssembly Technologies (MAT) - Specializes in manufacturing Die Attach machines and providing turn-key solutions for most advanced die attach applications.


 

Table Top Die Attach System

 

March Instruments - Providing a long tradition of innovation that has made Nordson the leading manufacturer of Gas Plasma Equipment for advanced packaging applications. Improve all of your assembly processes including wire bonding, die bonding, & encapsulation.


 

Plasma Treatment Systems

SST International - Flux-free, void-free, Fiber-Optic & Microelectronic Vacuum Sealing and Solder Reflow Furnaces. Applications include: die & substrate attach, low moisture package lid sealing, glass-to-metal sealing, wafer to glass bonding, solder ball attach, brazing, and many others.

 

SSTTableTopFurnace