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Datacon
- Leading supplier of Automatic Die/Flip Chip Bonders for
a wide variety of applications including: single chip, COB, FCOB, MCM,
hybrid, stacked die, PBGA, FCBGA, CSP, SIP. The Datacon 2200 apm Multichip
Die Bonder platform has extraordinary flexibility while maintaining a
very small footprint.
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Hesse & Knipps - Automatic Wedge Bonders for a variety of microelectronic applications. H&K’s bonders can be configured with a variety of handling options including Mag to Mag, lead frame handlers, or in-line (SMEMA) feeding. Access can be from 30 degree to 90 degree. All H&K bonders can be configured with bond quality controls which measure deformation. |
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Kulicke & Soffa - World's largest supplier of back-end semiconductor assembly equipment including a full line of Automatic & Manual Wire Bonders. Consumable products offered include Gold, Aluminum, & Copper Bonding Wire; Capillaries, Wedges, & Die collects; Hub Dicing Blades. |
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March
Instruments - Providing a long tradition of innovation that has
made Nordson the leading manufacturer of Gas Plasma Equipment
for advanced packaging applications. Improve all of your assembly processes
including wire bonding, die bonding, & encapsulation.
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SST
International - Flux-free, void-free, Fiber-Optic
& Microelectronic Vacuum Sealing and Solder Reflow Furnaces.
Applications include: die & substrate attach, low moisture package
lid sealing, glass-to-metal sealing, wafer to glass bonding, solder ball
attach, brazing, and many others.
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Miyachi Unitek - Leading supplier of Pulsed Nd: YAG & Fiber Lasers for precision welding cutting, & marking applications. Axia Systems Division: Ultra-Precision Auto-Align Laser Welding & Hermetic Lid Sealing Systems for Photonic Devices. |