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Assembly Materials

 

Centerline Technologies - Offers Custom Substrates providing ultra-precision grinding, lapping, polishing, diamond sawing and laser machining of 96% & 99.6% Alumina, BeO, Sapphire, Aluminum Nitride, Fused Silica Quartz, and Titanates, as well as co-planar finishing of filled vias for optical, electronic, medical, and telecommunication applications.
Electro-Glass Products - Supplier of precision drawn glass products for glass to metal seals and Powder Pressed Glass & Ceramic Parts. Specializing in small precision parts.
Form Cut Industries, Inc. - Manufacturer of low to high volume, competitively priced, quick-turn Pins, Leads, & Wire Forms. Form Cut is exceptionally skilled in working brass, copper, nickel base, and other exotic alloys.
Heraeus - Develops, manufactures and distributes Gold, Aluminum & Copper Bonding Wire for contacts in discrete and integrated components in the semiconductor industry.

International Manufacturing Services, Inc. - Premier provider of thick and thin film Chip Resistors & Chip Attenuators serving the military, wireless, automotive, aerospace, microelectronic, and medical industries just to name a few!

Kulicke & Soffa - Consumable products offered include Capillaries, Wedges, & Die Collets.

Microscreen - Experienced, quick turn supplier of precision Thick Film Screens & Laser Cut Stencils.
Toshiba America Electronic Components, Inc. - Worlds largest supplier of Aluminum Nitride (AlN) Ceramics. Specializing in: plain substrates, Aluminum Nitride with direct bonded copper (DBC), and Alumina with direct bonded copper.
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